InchFab offers a portfolio of modular fab lines, each engineered for a specific stage of the product lifecycle. From early-stage prototyping to high-volume production, our lines are designed to scale with your needs, delivering turnaround times as fast as one week and cost-per-chip performance rivaling traditional 200mm–300mm foundries.
ALL MODULES
Patterning & Metrology
- Maskless lithography
- Laser confocal, white light interferometer, reflectometer
Bond & Align
- Mask aligner
- Bond aligner
- Aligned wafer bonding – anodic, fusion, thermal compression
Coating
- Random access coater tool
- EBR
- Backside EBR
- Develop
- Pre/Post Bake
- HMDS
Dry Etch
- DRIE
- RIE Oxide
- RIE Nitride
- Up to 4 chambers/module
Deposition
- HDPCVD Oxide
- HDPCVD Nitride
- HDPCVD Silicon
- Up to 4 chambers/module
Plating
- 4 tank plating tool
Metal Deposition
- Sputter
- E-beam evaporation
Acid
- Multi tank semi-automatic acid station
Solvent
- 2-3 Tube Furnace stack for LPCVD, APCVD, Annealing
- RTA (optional)
Wafer Drying
- Multi tank semi-automatic solvent station
- Megasonics
High Temp
- Marangoni drying
- OR SRD
Patterning & Metrology
- Maskless lithography
- Laser confocal, white light interferometer, reflectometer
Bond & Align
- Mask aligner
- Bond aligner
- Aligned wafer bonding – anodic, fusion, thermal compression
Coating
- Random access coater tool
- EBR
- Backside EBR
- Develop
- Pre/Post Bake
- HMDS
Dry Etch
- DRIE
- RIE Oxide
- RIE Nitride
- Up to 4 chambers/module
Deposition
- HDPCVD Oxide
- HDPCVD Nitride
- HDPCVD Silicon
- Up to 4 chambers/module
Plating
- 4 tank plating tool
Metal Deposition
- Sputter
- E-beam evaporation
Acid
- Multi tank semi-automatic acid station
Solvent
- 2-3 Tube Furnace stack for LPCVD, APCVD, Annealing
- RTA (optional)
Wafer Drying
- Multi tank semi-automatic solvent station
- Megasonics
High Temp
- Marangoni drying
- OR SRD
At Partners, we deliver expert guidance that fuels business performance and long-term impact.
Modular
All enabled InchFab modular.
Custom Process
Enabled by individual modules.
One Process
One Fab
One Process
All enabled InchFab modular fabs.
Equipment
Dedicated
Equipment
Run your custom processes on dedicated equipment.
- Wafer Size: 100mm (4 inches)
- Fab Size
- Length: 50ft (12.2m)
- Width: 24ft (7.3m)
- Height: 15ft (4.5m)
- Must have 2M clearance around the fab
- Length: 50ft (12.2m)
- Width: 24ft (7.3m)
- Height: 15ft (4.5m)
- Must have 2M clearance around the fab
- Facilities Requirements
- Power: 220V 400A Supply (600A preferable)
- Ground: less than 3Ω
- HVAC: 7.5 Ton
- Exhaust: 2000CFM Corrosive compatible exhaust fan
- DI Water Plant¹
- Waste Containment²
- Power: 220V 400A Supply (600A preferable)
- Ground: less than 3Ω
- HVAC: 7.5 Ton
- Exhaust: 2000CFM Corrosive compatible exhaust fan
- DI Water Plant¹
- Waste Containment²
Have a question about our systems, services, or process capabilities? Fill out the form and we'll get back to you.
